Screen and Stencil Printing Processes for Wafer Backside Coating
Published: |
September 9, 2009 |
Author: |
Mark Whitmore, Jeff Schake. |
Abstract: |
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.... |
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