Avoiding the Solder Void

Published:

February 8, 2013

Author:

Richard Lathrop

Abstract:

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed....

  • Download Avoiding the Solder Void article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

  • Phone 610 825 6050
  • Fax 610 825 7061

See Company Website »

Company Postings:

(1) product in the catalog

(7) technical library articles

(7) news releases

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Avoiding the Solder Void article has been viewed 672 times

MSD Dry Cabinets

Global manufacturing solutions provider