Why Wide Fine Pitch Pads?

Published:

May 7, 1999

Author:

Rick Lathrop, Heraeus SMT Technical Services

Abstract:

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical...

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Company Information:

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

  • Phone 610 825 6050
  • Fax 610 825 7061

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Company Postings:

(1) product in the catalog

(7) technical library articles

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