Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes
Published: |
July 3, 2013 |
Author: |
Bob Wettermann, Hung Hoang |
Abstract: |
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.... |
|
Company Information:
More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes article has been viewed 968 times