Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
Published: |
March 30, 2017 |
Author: |
Bob Wettermann, BEST Inc. MIT |
Abstract: |
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.... |
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