Understanding Creep Corrosion Field Fails

Published:

March 16, 2022

Author:

Phil Isaacs, Jing Zhang & Terry Munson

Abstract:

Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction...

  • Download Understanding Creep Corrosion Field Fails article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

Consultant / Service Provider, Manufacturer

  • Phone (765)457-8095
  • Fax (765)457-9033

Foresite Inc. website

Company Postings:

(5) technical library articles

(1) news release

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Browse Technical Library »

Understanding Creep Corrosion Field Fails article has been viewed 132 times

Facility Closure

best reflow oven