Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Published: |
March 8, 2007 |
Author: |
Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee |
Abstract: |
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Henkel Electronic Materials »
- Nov 10, 2020 - Printed Electronics for Medical Devices
- Oct 14, 2020 - FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES
- Nov 30, 2016 - Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
- Mar 10, 2011 - Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
- Sep 23, 2010 - Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
- See all SMT / PCB technical articles from Henkel Electronic Materials »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force article has been viewed 679 times
