Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Published: |
January 6, 2010 |
Author: |
Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews - Henkel / Ablestik Laboratories |
Abstract: |
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Henkel Electronic Materials »
- Nov 10, 2020 - Printed Electronics for Medical Devices
- Oct 14, 2020 - FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES
- Nov 30, 2016 - Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
- Mar 10, 2011 - Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
- Sep 23, 2010 - Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
- See all SMT / PCB technical articles from Henkel Electronic Materials »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA article has been viewed 873 times
