Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
Published: |
March 10, 2011 |
Author: |
Neil Poole, Ph.D. and Brian Toleno, Ph.D. |
Abstract: |
History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead... |
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