PCB Dynamic Coplanarity At Elevated Temperatures
Published: |
November 10, 2011 |
Author: |
John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman |
Abstract: |
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity ... |
|
|
|
|
|
|
You must be a More articles from iNEMI (International Electronics Manufacturing Initiative) »
- Apr 08, 2021 - Investigation of Factors That Influence Creep Corrosion
- Apr 08, 2021 - Qualification Test Development for Creep Corrosion
- May 08, 2019 - Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material
- May 09, 2018 - Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
- Jul 16, 2015 - Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
- See all SMT / PCB technical articles from iNEMI (International Electronics Manufacturing Initiative) »
More SMT / PCB assembly technical articles »
- Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
- Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Browse Technical Library »
PCB Dynamic Coplanarity At Elevated Temperatures article has been viewed 544 times
