iNEMI Pb-Free Alloy Characterization Project Report: Part II - Thermal Fatigue Results For Two Common Temperature Cycles
Published: |
September 8, 2021 |
Author: |
Richard Parker, Richard Coyle, Gregory Henshall, Joe Smetana, Elizabeth Benedetto |
Abstract: |
The Pb-Free Alloy Characterization Program sponsored by International Electronics Manufacturing Initiative (iNEMI) is conducting an extensive investigation using accelerated temperature cycling (ATC) to evaluate ball grid array (BGA) thermal fatigue performance of 12 commercial or developmental Sn based Pb-free solder alloys. This paper presents the initial findings from a specific subset of the temperature cycling test matrix. The focus is on comparing alloy performance for two of the most commonly specified temperature cycles, 0 to 100 °C and -40 to 125 °C.... |
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