Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
Published: |
April 30, 2009 |
Author: |
Kevin Knadle. |
Abstract: |
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from i3 Electronics »
- Mar 13, 2023 - Printable Electronics: Towards Materials Development And Device Fabrication
- Aug 14, 2014 - Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization.
- May 05, 2011 - Manufacturing Substrates with Embedded Passives
- Dec 22, 2010 - Nanofluids, Nanogels and Nanopastes for Electronic Packaging
- Oct 28, 2010 - Organic Optical Waveguide Fabrication in a Manufacturing Environment
- See all SMT / PCB technical articles from i3 Electronics »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World article has been viewed 1145 times
