Solder Paste Inspection Technologies: 2D-3D Correlation
Published: |
May 28, 2008 |
Author: |
Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp. |
Abstract: |
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.... |
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