Solder Paste Inspection Technologies: 2D-3D Correlation

Published:

May 28, 2008

Author:

Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

Abstract:

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

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Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

  • Phone 5085414749
  • Fax 5085202288

See Company Website »

Company Postings:

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