Effect of Contact Time on Lead-Free Wave Soldering

Published:

August 28, 2008

Author:

Jim Morris, Richard Szymanowski

Abstract:

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

  • Download Effect of Contact Time on Lead-Free Wave Soldering article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

  • Phone 5085414749
  • Fax 5085202288

See Company Website »

Company Postings:

(14) technical library articles

(19) news releases

  • Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
  • Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
  • Jan 17, 2023 - Flux Management | Heller Industries Inc.
  • Browse Technical Library »

Effect of Contact Time on Lead-Free Wave Soldering article has been viewed 699 times

ONLINE IPC Training & Certification
MSD Dry Cabinets
Reflow Oven

Flux-Free Reflow Soldering