Effect Of Squeegee Blade On Solder Paste Print Quality

Published:

June 17, 2010

Author:

Rita Mohanty, Bill Claiborne; Speedline Technologies | Frank Andres; Cookson Electronics

Abstract:

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process....

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Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

  • Phone 5085414749
  • Fax 5085202288

See Company Website »

Company Postings:

(14) technical library articles

(19) news releases

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