Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing

Published:

May 5, 2003

Author:

By Alden Johnson, Cookson Electronics Equipment, Franklin,Mass.

Abstract:

The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization....

  • Download Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer

  • Phone 508-520-0083

See Company Website »

Company Postings:

(4) products in the catalog

(10) technical library articles

  • Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
  • Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
  • Jan 17, 2023 - Flux Management | Heller Industries Inc.
  • Browse Technical Library »

Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing article has been viewed 723 times

2023 IPC Certification Training Schedule Eptac

Manufacturing Software