Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives
Published: |
June 11, 2009 |
Author: |
Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti, Bawa Singh |
Abstract: |
The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Cookson Electronics »
- Sep 08, 2021 - Effect Of Silver In Common Lead-Free Alloys
- Jul 02, 2020 - A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS
- Oct 20, 2018 - SMT Troubleshooting Guide
- Mar 05, 2018 - Stencil Design for Lead-Free SMT Assembly
- Mar 27, 2014 - PCB Surface Finishes & Cost Effective Pb Free Assembly Materials
- See all SMT / PCB technical articles from Cookson Electronics »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives article has been viewed 844 times
