Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
Published: |
October 29, 2009 |
Author: |
Reiner Zoch, Product Manager Christian Ott, Sales and Project Manager SEHO Systems GmbH |
Abstract: |
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process.... |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes article has been viewed 898 times