The Effect of Coating and Potting on the Reliability of QFN Devices.

Published:

August 28, 2014

Author:

Greg Caswell, Cheryl Tulkoff.

Abstract:

The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining relevant information can be difficult since information is often segmented and the focus is on design opportunities not on reliability risks (...)

Commonly used conformal coating and potting processes have resulted in shortened fatigue life under thermal cycling conditions. Why do conformal coating and potting reduce fatigue life? This paper details work undertaken to understand the mechanisms underlying this reduction. Verification and determination of mechanical properties of some common materials are performed and highlighted. Recommendations for material selection and housing design are also given....

  • Download The Effect of Coating and Potting on the Reliability of QFN Devices. article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

  • Phone 301 474-0607
  • Fax 240 757-0083

DfR Solutions website

Company Postings:

(1) product in the catalog

(23) technical library articles

(1) news release

  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitectorâ„¢ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Browse Technical Library »

The Effect of Coating and Potting on the Reliability of QFN Devices. article has been viewed 711 times

Dual Lane Reflow Oven

pcb assembly supplies