Accurately Capturing System-Level Failure of Solder Joints

Published:

February 5, 2020

Author:

Maxim Serebreni

Abstract:

Consortium Projects - Thermal Cycling Reliability

  • Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions.
  • Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..
...

  • Download Accurately Capturing System-Level Failure of Solder Joints article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

  • Phone 301 474-0607
  • Fax 240 757-0083

DfR Solutions website

Company Postings:

(1) product in the catalog

(25) technical library articles

(1) news release

  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Browse Technical Library »

Accurately Capturing System-Level Failure of Solder Joints article has been viewed 571 times

Digital Inspection Equipment

SMT feeders