Selective Soldering Process

Published:

January 24, 2008

Author:

Paul Bratt, Lead Package Engineer

Abstract:

Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components. Often, there are interconnect hardware, displays, or other components that cannot withstand the exposure to the high temperature involved in the wave soldering process. They are generally soldered by hand. The challenge is to determine the optimal method manufacturers can use to solder these boards populated with mixed technology....

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Company Information:

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, USA

Other

  • Phone (610) 362-1320
  • Fax (610) 362-1290

Electronics Manufacturing Productivity Facility (EMPF)  website

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