Stencil Printing of Small Apertures
Published: |
October 25, 2012 |
Author: |
William E. Coleman Ph.D. |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.... |
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davef
October 31, 2012
The Electroformed stencil with Nickel-Teflon plating had good transfer for each aperture size until the 150 micron opening. Why do you suppose that it had such a dramatic roll-off in transfer rate with that small aperture?