Soldering Immersion Tin

Published:

April 10, 2019

Author:

Rick Nichols, Sandra Heinemann

Abstract:

The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs.

The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm....

  • Download Soldering Immersion Tin article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Components/Substrates, Manufacturer of Assembly Material, Manufacturer of Components

  • Phone (+49) 30-349 85-0
  • Fax (+49) 30-349 85-777

Atotech website

Company Postings:

(2) products in the catalog

(8) technical library articles

(1) news release

  • May 23, 2019 - Identifying Flux Residues | ACI Technologies, Inc.
  • May 23, 2019 - Cleaning | ACI Technologies, Inc.
  • May 23, 2019 - Wedge Bonding Tool Selection | ACI Technologies, Inc.
  • May 23, 2019 - Experimentation for Success | ACI Technologies, Inc.
  • May 21, 2019 - Flip Chip Attach Techniques | ACI Technologies, Inc.
  • Browse Technical Library »

Soldering Immersion Tin article has been viewed 141 times

Electronics Auditor Job

FPC* - Fluid Pressure Control - Dispensing Pump