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High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives

Published:

April 5, 2018

Author:

Dr. Mary Liu and Dr. Wusheng Yin

Abstract:

The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance. ...

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Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Adhesives/Dispensing, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(26) products in the catalog

(15) technical library articles

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