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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Published:

June 21, 2012

Author:

Richard Coyle, Richard Popowich, Peter Read, and Debra Fleming - Alcatel-Lucent, Raiyo Aspandiar, Alan Donaldson, Stephen Tisdale, and Vasu Vasudevan - Intel Corporation, Iulia Muntele, Robert Kinyanjui - Sanmina-SCI Corporation

Abstract:

First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion...

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Company Information:

Alcatel-Lucent- Enterprise Business Group is a world leader in the delivery of communications solutions for businesses, including contact center software, small/medium business telephony and IP addres

Calabasas, California, USA

Consultant / Service Provider

  • Phone 818-878-4851
  • Fax 818-871-5952

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Company Postings:

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