Novel Approaches for Minimizing Pad Cratering

Published:

October 29, 2015

Author:

Chen Xu, Yunhu Lin; Alcatel-Lucent, Yuan Zeng, Pericles A. Kondos; Unovis-Solutions.

Abstract:

With the electronic industry moving towards lead-free assembly, traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow temperature required by lead-free solders. Lead-free compatible laminates with improved heat resistance have been developed to meet this challenge but they are typically more brittle than SnPb laminates causing some to be more susceptible to pad cratering. In this paper, two novel approaches for minimizing pad cratering will be discussed. Preliminary results which validate the two approaches will also be presented....

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Company Information:

Alcatel-Lucent- Enterprise Business Group is a world leader in the delivery of communications solutions for businesses, including contact center software, small/medium business telephony and IP addres

Calabasas, California, USA

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