Flip Chip Attach Techniques
Published: |
May 21, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).... |
|
More articles from ACI Technologies, Inc. »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality
- Sep 02, 2020 - Reworking ALD Coatings
- Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection
- Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study
- See all SMT / PCB technical articles from ACI Technologies, Inc.
»
More SMT / PCB assembly technical articles »
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
- Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components | ITW EAE
- Browse Technical Library »
Flip Chip Attach Techniques article has been viewed 300 times