BGA Reballing

Published:

May 30, 2019

Author:

ACI Technologies, Inc.

Abstract:

In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out....

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Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

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(121) upcoming training courses

(64) technical library articles

(3) news releases

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