Component Failure Analysis - Hermetic Packaging


June 11, 2019


ACI Technologies, Inc.


Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested....

  • Download Component Failure Analysis - Hermetic Packaging article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(121) upcoming training courses

(64) technical library articles

(3) news releases

  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components | ITW EAE
  • Apr 14, 2020 - Selective Solder Fine Pitch Components On High Thermal Mass Assembly | ITW EAE
  • Browse Technical Library »

Component Failure Analysis - Hermetic Packaging article has been viewed 342 times

Vortik dispensing systems 1k and 2k solutions - Nordson Asymtek

Reflow Oven