• SMTnet
  • »
  • Technical Library
  • »
  • Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Published:

June 21, 2019

Author:

ACI Technologies, Inc.

Abstract:

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation....

  • Download Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(125) upcoming training courses

(64) technical library articles

(3) news releases

  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components | ITW EAE
  • Browse Technical Library »

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing article has been viewed 330 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing
SMT feeders

 Reflow System