Pad Cratering
Published: |
May 8, 2020 |
Author: |
ACI Technologies, Inc. |
Abstract: |
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from ACI Technologies, Inc. »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality
- Sep 02, 2020 - Reworking ALD Coatings
- Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection
- Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study
- See all SMT / PCB technical articles from ACI Technologies, Inc. »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Pad Cratering article has been viewed 996 times