Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
Published: |
July 25, 2018 |
Author: |
Jun Balangue |
Abstract: |
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly (PCBA). The following topics will be discussed to demonstrate the capability of boundary-scan test system on how we can extend beyond typical manufacturing test: Boundary-scan as a complete manufacturing test system, Boundary-scan implementation during PCBA design stage, Implementation of boundary-scan beyond typical structural testing... |
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