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Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat

Published:

August 7, 2019

Author:

Anna Lifton, Paul Salerno, Jerry Sidone, Oskar Khasalev

Abstract:

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.

Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.

A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed....

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Company Information:

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer of Assembly Material

  • Phone 814-941-1694
  • Fax 814-940-3811

Alpha Assembly Solutions website

Company Postings:

(2) technical library articles

  • Aug 19, 2019 - Automated Testing with Boundary Scan | ACI Technologies, Inc.
  • Aug 14, 2019 - Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance | KYZEN Corporation
  • Aug 08, 2019 - Selective Soldering and the Modular Approach | ACI Technologies, Inc.
  • Aug 01, 2019 - Attaching Fiber Optic Modules | ACI Technologies, Inc.
  • Jul 29, 2019 - Conformal Coating Processes | ACI Technologies, Inc.
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