Low Temperature Soldering Using SN-BI Alloys
Published: |
April 1, 2020 |
Author: |
Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D. |
Abstract: |
Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices. Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.... |
|
Company Information:
More articles from Alpha Assembly Solutions »
- Jul 02, 2020 - Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency
- Oct 16, 2019 - Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints
- Aug 07, 2019 - Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
- Jul 13, 2017 - Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
- See all SMT / PCB technical articles from Alpha Assembly Solutions »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Low Temperature Soldering Using SN-BI Alloys article has been viewed 785 times