• SMTnet
  • »
  • Technical Library
  • »
  • High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

Published:

February 6, 2019

Author:

Karl Sauter

Abstract:

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods....

  • Download High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Oracle Corporation

Oracle Corporation is an American multinational computer technology corporation specializing primarily in developing and marketing database software and technology, cloud engineered systems, and enterprise software products.

Redwood Shores, California, USA

Software Manufacturer

  • Phone +1.650.506.7000

Oracle Corporation website

Company Postings:

(1) technical library article

  • Jul 11, 2019 - Design of Experimentation for Affordability | ACI Technologies, Inc.
  • Jul 10, 2019 - Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow | Heller Industries Inc.
  • Jul 05, 2019 - Fourier Transform Infrared Spectroscopy | ACI Technologies, Inc.
  • Jul 01, 2019 - Computer Aided Design, Manufacturing, and Engineering | ACI Technologies, Inc.
  • Jun 24, 2019 - Manufacturing Cost Reduction through Automation | ACI Technologies, Inc.
  • Browse Technical Library »

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project article has been viewed 243 times

  • SMTnet
  • »
  • Technical Library
  • »
  • High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project
TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Flying Probe Probe Tester with AOI