Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-on-Polymer ICs
Published: |
August 18, 2021 |
Author: |
Darrell E. Leber, Brian N. Meek, Seth D. Leija, Dale G. Wilson, Richard L. Chaney, and Douglas R. Hackler |
Abstract: |
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-on-Polymer ICs article has been viewed 328 times
