Yamaha YV100X

Yamaha YV100X parameters
Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min)
Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM)
Board transfer direction right-left
Mounting accuracy ±0.1mm/CHIP ±0.08/QFP
Mounting speed 0.20 seconds/CHIP 1.7 seconds/QFP (with 4 flying nozzles)
Yamaha YV100X original types Ribbon components: 100 types (MAX, 8MM tape conversion) 0402--CHIP, MELF, SOT, PLCC, QFP, BGA, CSP and special-shaped electromechanical components, pin spacing ≥ 0.4mm
Original pallets: 80 types (used for TMAX, YTF)
Original supply form 8-56mm wide band, rod, bulk, pallet
Mounting original 0603-32mm original, long plug-in, CSP, BGA, QFP
Power supply Three-phase AC220/208/230/240/380/400/416V ±10%, 50/60HZ
Power 4KVA
Air pressure above 0.55MPA, 350MIN
Dimensions L1650*W1408*H1850
Weight 1570KG

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