Test Research (TRI) TR7007 3D Solder Paste Inspect

Model:	Test Research (TRI) TR7007 3D Solder Paste Inspect
Category:	SPI / Solder Paste Inspection
Model Year:	2011
Condition:	used
Location:	Oregon, USA
Offered by:	SMT Devices
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SKU 16529
• Fastest solder paste inspection (SPI) system
• Excellent 3D inspection
• 3D SPI system for mid- to high-volume manufacturing
• Great inspection ability of lead-free manufacturing process and fine-pitch/01005 components
• 14 micrometers resolution
• Inspection Speed up to 171cm2/s @14μm
• 87cm2/sec at 10 micrometers resolution
• Warp Auto-Tracking system, provides outstanding defect-detecting ability
• Camera is capable of 200 frames per second
• 100 frames for each side respectively
• Processes images using dual phase-shifted fringe patterns that eliminates shadows and provides the best possible defect detection
• Phase-shifted fringe pattern to measure height profiles of solder paste deposited upon a circuit board prior to placement
• Strobe illuminator provides short timed exposures
• Eliminates shadowing that creates a similar affect as two cameras
• Create inspection programs quickly and easily
• PC system calculates the statistical data and provides statistical reports
• Scan Width 23.2mm
• Maximum Inspection Area 20 x 18 inches (510 x 460 mm)
• Scan Time (254x148 sq.mm) 8.7s
• Scan Time (330x250 sq.mm) 16.0s
• Shadow Free Inspection
• Smallest solder capable 01005