Cyberoptics SE300 Ultra 3D SPI
Cyberoptics SE300 Ultra 3D SPI has been sold
Model: |
Cyberoptics SE300 Ultra 3D SPI |
Category: |
|
Model Year: |
2008 |
Condition: |
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Location: |
USA |
Offered by: |
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| Contact Lewis & Clark |
Vintage: 2008
Description: 3D Solder Paste Inspection
Details:
• 3D sensing system w/ built-in fiducial camera and lighting
• MicroPad Sensor
• Mechanical board stop
• Auto-width adjust conveyor
• Max PCB width: 20” x 20”
• Max inspection area: 20” x 19.5”
• Max pad size: 0.197” x 0.394”
• Paste height range: 2-14mils
• Height resolution: 0.005mils
• Measurement types: Height, Area, Volume, Registration, Bridge Detection
• Process Insight SPC software
• GC-PowerPlace Gerber and ODB++ file conversion software for off-line programming
• NIST-traceable measurement certification standard certified for height, area and volume
Condition: Complete & Operational
Location & Shipping: North America / FOB origin
Availability: Immediate for purchase
Company Information:
