SUPPLIER: Capital Equipment Exchange
Universal Instruments GSMxs SMT Pick & Place
Universal Instruments GSMxs SMT Pick & Place has been sold
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Universal Instruments GSMxs SMT Pick & Place |
Category: |
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Condition: |
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Location: |
Illinois, USA |
Offered by: |
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| Contact Supplier |
Small foot print GSM with Linear Motors like a Genesis.
- Flip Chip Application
- Die Attach Application
- Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components.
- Building PBGA (plastic ball grid array) components.
- Building PGA (pin grid array) components.
- Building silicon on silicon multi-chip modules.
- Building hybrid circuits.
- Building a PCMCIA format PCB with SMT components including resistors, capacitors, TSOPs, QFPs, and flip chips.
- Building PCBs and flex cables with COB technology.
Specifications
- 10" x 13" Max PCB size
- additional specs, pending
Configuration
- Single Beam
- 4 Spindle Flex Head
- 0.5mpp Magellan Camera (front mount)
This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.
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