Yamaha YS88 multi-function module chipmounter

Product number: YS88
Products in detail
The characteristics of
Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element
The height of the object elementcorresponds to 25.5 mm
10 ~ 30 n can be easy to stick load weightcontrol
All the time, QFP pasted on absoluteaccuracy + 30 microns, repeatedly QFP pasted on the accuracy of plus or minus20 microns
Corresponding multifunctionalspecial-shaped requirements, with 8400 CPH (equivalent to 0.43 seconds/CHIP:best conditions) ability of SMT
Substrate: (L510 x W460mm) corresponding tothe L size
Object substrate: L50 * W460mm W50mm ~ L510
SMT efficiency
Conditions (best) 8400 CPH/CHIP (equivalentto 0.43 seconds/CHIP)
SMT precision: (the company standardcomponents) absolute accuracy (mu + 3 sigma) : + / - 0.05 mm/QFP/CHIP, plus orminus 0.03 mm
Repeatability: (3 sigma) : + / - 0.03mm/QFP/CHIP, plus or minus 0.02 mm
Object components: 0402 (mm) - - 55 mmcomponents, SOP/SOJ, PLCC, QFP, joint, CSP/BGA, long joint (below W45 x L100mm)
Simple put heavy load control (10 ~ 30 n),need to press in SMT special-shaped components (special connector, etc.)
Below the object element height: 25.5 mm
Before moving into the base plate aboveallowed height below 6.5 mm
Element types
119 (maximum/conversion into 8 mm tape)(note 1)
81 (maximum/conversion into 8 mm tape, whenassembling sATS)
Power specifications: three-phase AC200/208/220/240/220/240/416 V + 10% for 50/60 Hz
For the gas source: more than 0.45 MPa,clean and dry condition
Overall dimensions
L1, 1562 (flat side) of 665 x W x H 1445 mmabove (cover)
L1, 665 x 1615 W (batch replacement carguide side) x H1, 445 m above (cover)
Body weight: about 1650 kg (only body)