Juki RX - 6

Product number: RX - 6
Detailed product introduction
Characteristic：
With high productivity, versatility, highquality new modular placement machine RX - 6 listed
Draw/monitor corresponding patch
Components in speed
Chip components: 42000 CPH * 1 (bestconditions)
IC components: 14000 CPH * 1
Element size: 0402 (1005) chip * 2 ~ 50 mmsquare components
0402 (01005) inch chip ~ 50 mm squarecomponents / 50 * 180 ㎜ * 3
Substrate size:
Single track teleport: 50 x 50 ~ 610 x 590mm x 590/905 transfer (2 times)
Dual track teleport: 50 * 50 ~ 360 * 360 ㎜
Posted of the specifications of the opening
Six of the suction nozzle opening
Three of the suction nozzle opening
We also can produce according tocorresponding dual track
The 1.25 m wide province space design
Check standard drain/patch monitor functionto achieve the higher quality
By changing the opening, it is possible tobuild the best production line to adapt to changes in products
The image recognition to realize high speedSMT by no pauses
Corresponding ultra-high components, largecomponents, large substrates
The new matrix tray server TR8S raised thecorresponding ability and productive element.
* 1 6 x6 suction nozzle opening
* 2 6 suction nozzle opening
* 3 3 suction nozzle opening
Parameters:
High-speed placement machine RX module - 6:(6 suction nozzle opening)
High-speed placement machine RX module - 6:(three suction nozzle opening)
Substrate size
Single orbit transfer 50 x 50 ~ 610 x 590mm x 590/905 transfer (2 times)
Dual track transport 50 x 50 ~ 360 x 360 ㎜ * 1
Component height of 6 mm specification:6/12/20/25/33 mm
Element size: laser identification of 0402(01005) inch chip ~ 50 mm square elements
0402 (01005) inch chip ~ 33.5 mm squareelement (3 suction nozzle opening)
0402 (01005) inch chip ~ 50 mm squareelement (6 suction nozzle opening)
Image recognition: standard camera 3 mm ~33.5 mm square elements
3 mm ~ 100 mm square element, or 50 * 180mm
High resolution camera (are) of choose andbuy
1.0 x 0.5 mm to 20 mm square element
1.0 x 0.5 square element, or 24 ~ 48 mm x72 mm
Component placement speed (chip components)
Best conditions * 2:42 and 000 CPH / 34000CPH
IC * 3:14, 000 CPH / 11000 CPH
Component placement accuracy
Laser identification: + / - 0.04 mm (Cpk ≧ 1)
Image recognition: + / - 0.04 mm / + / -0.03 mm
Element SMT categories: up to 160 species(converted to 8 mm band (using a dual-track type belt type feeder))
Remark:
* 1 single mode maximum 360 x450mm
* 2 monorail send specifications
* 3 IC component element pasted on speed isin M size substrate with 36 points when loading the general value, appearancesize is below 10 mm square QFP components is when the components before, duringand after the configuration to use all of the suction nozzle to learn at thesame time.