Samsung SMT Pick and place machine samsung CP45FV-NEO machine
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Samsung SMT Pick and place machine samsung CP45FV-NEO machine |
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Model: CP45FV-NEO
Mounting speed:14,900CPH(IPC9850)
Component recognition range:1005(0402)～□32mmIC 0603(0201) ～□42mm(option)
Placement accuracy:±0.08mm/CHIP;±0.04mm/CFP
PCB SIZE: 50×30×0.3～460×400×4.2 50×100×0.38～510×460
8mm FEEDER: 98EA
SIZE: (L×W×H)（mm）:1,650×1,540×1,370
High-speed flight centering image system
This unique SHSV system, 6 placement heads, each placement head is equipped with a dedicated image system, this flight calibration allows the CP45 to identify components without moving to a fixed position, thus effectively using the movement of the machine to make the entire paste The loading speed is increased to 0.178 seconds/CHIP.
High-speed placement CSP
When mounting CSP or QFP, the speed performance of the flight image system is more obvious, not only can pick up 6 components at a time, but also can recognize when the arm moves, so that it can be mounted to the most accurate position.
Stand-alone solution
CP45 is a high-speed, flexible SMD placement system that can handle a variety of components at high speed. This single-machine solution has been adopted by many customers and gradually replaced the traditional placement machine + multi-function machine solution.
Wide range of component recognition
The fixed image system is used in combination with the flying image system to make the component mounting range from 0603 to □42mm IC, including 0.3mm fine pitch QFP&0.5mm fine pitch CSP.
Flexible placement head design
All placement heads are designed to handle fine-pitch components. This feature makes the placement process simple and efficient, thereby improving work efficiency and flexibility.
Digital lighting system
The lighting system is pre-adjusted according to the shape of the component, and 16 kinds of brightness are controlled by the program, and the brightness is continuously enhanced to identify the component image most clearly.
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