Hexi SF-820-LF

Hexi SF-820-LF

Hexi SF-820-LF


Hexi SF-820-LF


Soldering - Reflow

Model Year:






Offered by:

Hexi Electronic Equipment Co.,LTD

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Reflow oven features:


A. Windows XP operation software with Chinese and English alternative available. Whole system under intergration control can analyze and display the failure. All production data can be saved competely and analyzed.


B. PC& Siemens PLC controling unit with stable performance; high precision of precision of profile repetition can avoid product loss attributed bu abnormal running of the computer.


C. Unique design of the thermal convection of the heating zones from 4 sides provides high heat efficiently; high △ T between 2 joins zones can avoid the temperature interference; It can shorten the temperature difference between big-size and small component and meet the soldering demand of complex PCB.


D. Forced air cooling or water cooling chiller with efficient cooling speed suits all difference kinds of lead-free soldering paste.


E. Low power consumption (8-10 KWH/hour) to save the manufature cost.


F. With complete alarms system, failures can listed on the PC interface.




Delivery leadtime: 30-35 working days


Training: provide 7 days training, food accommodation to engineers from customers.




This Hexi SF-820-LF has been added in 26 Oct 2011

This Hexi SF-820-LF has been viewed 745 times.

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