May 12, 2014 BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will participate in ACI Technologies' Technical Exposition, scheduled to take place May 14-15, 2014, at the ACI facility in Philadelphia, PA. The free two-day event will feature equipment demonstrations and technical presentations.
Mastering the solder paste reflow profile is usually the last step to locking down the SMT assembly. An industry expert from BTU will discuss the development of reflow profiles for printed circuit board solder reflow, semiconductor packaging and lead-free processes.
To register for the event, contact Katie Riggan by phone at 610-362-1200, extension 250 or via email at registrar@aciusa.org. Please note that capacity is limited, so reserve your place today. For more information on the ACI Technologies' Technical Exposition, the complete agenda can be seen here.
For more information about BTU International, visit www.btu.com.
BTU International is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the U.S.A., Asia and Europe.
