Oct 22, 2025 
SEHO Systems GmbH, a world-leading manufacturer of complete solutions for soldering processes and automated production lines, will present innovative machine technologies and targeted upgrades for high-end systems from all product areas, at productronica 2025 in hall A4, booth 578. The new developments are geared toward demanding applications in electromobility and power electronics and impress with their sophisticated process architecture, high flexibility, and consistent focus on efficiency.
PowerSelective is already a unique system today: it combines three different soldering processes in a single system with minimal footprint – from flexible miniwave soldering processes to high-throughput multiwave processes and conventional wave soldering.
With the new PowerSelective-HD, SEHO is presenting a next-generation selective soldering system at productronica that will take electronics manufacturing to a new level in terms of flexibility, production volume, and process reliability.
In the fluxer area, a newly integrated fiducial camera ensures even greater positioning precision – a clear advantage, especially for complex layouts and high-density assemblies.
The new cluster preheating concept enables only the relevant areas of an assembly to be thermally treated for the subsequent soldering process. This significantly reduces energy consumption as all other areas are not exposed to heat.
For each heating station, the selective cluster heating system consists of up to 30 short-wave, gold-coated radiators that can be controlled individually and heat even the smallest areas efficiently and precisely. The combination of their directional heat radiation and high energy efficiency sets new standards in thermal process control. Even with multiwave soldering, the preheating process can be adapted precisely to the assembly layout for maximum energy savings, with thermal stress applied only where necessary.
The concept is supplemented by a scalable IR cluster top heater with 4 or 16 zones, which ensures uniform heating, especially for heavy assemblies.
All heating modules are designed in a maintenance-friendly drawer style.
The newly developed soldering unit offers a significantly larger soldering area and can be flexibly adapted to different production requirements.
For maximum flexibility, two different multiwave tools, each up to 250 x 400 mm, can be set up simultaneously – ideal for varied production or frequently changing assemblies.
Alternatively, two identical soldering tools with a total soldering area of up to 500 x 500 mm can be used. This significantly increases throughput, for example in multi-panel applications: a single dip process is sufficient to solder several assemblies simultaneously.
In line with resource-saving operation, an integrated Eco mode minimizes the system’s nitrogen consumption.
For highest quality requirements, both a selective brushing system for removing solder balls and the PowerVision THT-AOI system for solder joint inspection can be integrated into the system. Both additional processes run in parallel on separate axes without affecting the cycle time. The result: maximum process reliability with consistently high throughput.
Designed for use in future-oriented electronic applications, such as e-mobility, battery management and converter technology, the new PowerSelective-HD is the perfect solution. It can process assemblies weighing up to 25 kg, offering maximum component freedom on both the top and bottom side.
Increased efficiency and intelligent process control are also the focus in wave soldering.
Following the successful upgrade of the preheating area with particularly economical pulsar emitters, which reduce energy consumption by up to 30 %, and the introduction of innovative functions for the soldering area, such as automatic nozzle height adjustment and wave height control, the fluxer area has now been specifically further developed.
SEHO has implemented segmented flux application for the high-end wave soldering system MWS 2300, which enables potential savings of up to 50 % depending on the assembly layout. Only those areas of the assembly where solder joints are actually located are applied with flux. Up to eight separate segments can be defined per assembly, which significantly reduces consumption and maintenance requirements and also has a positive effect on the process.
Additional energy savings are achieved by a newly developed, optimized tunnel insulation that effectively minimizes heat loss during the process.
Experience SEHO’s new systems live at productronica 2025 in Munich.
