Nov 03, 2025 SAKI Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will showcase its latest innovations at Productronica 2025, taking place from November 18-21, 2025 at Messe München, Germany. Visitors to Hall A2, Booth 259 will discover SAKI's full line-up of advanced inspection systems and intelligent software solutions designed to drive the future of smart manufacturing.
SAKI will present its comprehensive range of 3D SPI, AOI, and AXI inspection systems, covering applications from SMT to back-end PCB and THT solder inspection. Live demonstrations will illustrate how SAKI's precision inspection technologies deliver superior accuracy, flexibility, and connectivity for next-generation manufacturing environments.
A key highlight will be the 3Di-LS3EX 15 µm Z-axis & side camera AOI model, equipped with an upgradeable optical head, dome lighting, and advanced solder inspection algorithms for superior precision and productivity. The latest 3Xi-M110v4 will also be demonstrated as the fastest inline AXI solution in its class, featuring a 130 kV X-ray source that ensures exceptional image quality, stability, and long-term reliability.
Adding to the Productronica 2025 machine line-up, the booth will feature SAKI's latest prototype inspection solution. This special preview offers visitors an exclusive opportunity to experience the next evolution of SAKI's inspection technology before its official release in early 2026.
Exhibited Inspection Solutions
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3Si-LS3EX (3D SPI) - 8 µm resolution for high-precision solder paste inspection with fast, stable measurement performance;
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3Si-LS3GX (3D SPI) - 15 µm resolution for high-speed, high-precision solder paste inspection;
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3Di-LS3EX (3D AOI) - 15 µm resolution with Z-axis solution and side camera system;
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3Di-LS3 (3D AOI) - 8 µm resolution with Z-axis solution and 45-degree side camera system;
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3Xi-M110v4 (3D AXI) - 130 kV X-ray tube, 6.7 MPix detector, providing industry-leading speed and reliability;
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Exclusive preview: 3Di-LS3BX next-generation AOI solution for bottom-side inspection (launching 2026).
Complementing the hardware exhibits, SAKI will demonstrate its full suite of intelligent software solutions. These include QD Analyzer for real-time process quality control and Remote Management System (RMS) for connected factory monitoring - together exemplifying SAKI's commitment to delivering high-performance, data-driven inspection systems that enable truly smart manufacturing.
Software Solutions Showcase
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BF-MPV - Multi-process viewing platform for streamlined inspection management;
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BF2-Editor for AOI & AXI - Unified editing environment for flexible programming;
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QD Analyzer - Comprehensive SPC, process quality, and traceability tool with IPC-CFX connectivity;
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AI Solution - Enhancing inspection performance through deep-learning algorithms.
Visitors to Productronica 2025 will discover how SAKI's latest hardware and software innovations are shaping the future of intelligent, connected manufacturing. SAKI's experts will be on hand throughout the trade fair to provide in-depth demonstrations and discuss customized inspection solutions tailored to diverse production needs.
For more information about SAKI visit www.sakicorp.com/en/.
Since its inception in 1994, SAKI has led the way in the development of automated recognition through robotic vision technology. SAKI's 3D automated solder paste, optical, and X-ray inspection and measurement systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. SAKI Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
