News Releases from Indium Corporation
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418 news releases added by Indium Corporation
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Indium Corporation Technology Expert to Present at Brasage
May 13, 2014 | Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability Conference
May 07, 2014 | Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
Indium Corporation Expert to Present at International Conference on Soldering and Reliability
May 06, 2014 | Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
Indium Corporation Technology Experts to Present at PCIM Europe
May 05, 2014 | Indium Corporation technology experts will present at PCIM Europe May 20-22 in Nuremberg, Germany.
Indium Corporation Features SACm™ High-Reliability Solder Paste at SMT Hybrid Packaging
Apr 30, 2014 | Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.
Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes
Apr 30, 2014 | Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Indium Corporation Technology Experts to Present at IMAPS New England
Apr 18, 2014 | Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.
Indium Corporation Technology Expert to Present at SMTA Intermountain
Apr 10, 2014 | Indium Corporation's Greg Wade, technical support engineer - global accounts, will present at the regional SMTA expo in Boise, Idaho on April 17.
Indium Corporation Vice President of Technology to Present at IWWPE
Apr 08, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present The Status and Prospect of Silver Sintering Paste Development. This presentation will discuss the significance of silver sintering paste for high power semiconductor devices and its future potential .
Indium Corporation Features SACm™ at NEPCON China
Apr 03, 2014 | Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.
Indium Corporation Technology Experts to Present at Southeast Asia Technical Conference
Apr 02, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.
Indium Corporation Celebrates 10th Anniversary of Live at APEX
Mar 27, 2014 | Indium Corporation is pleased to announce the 10th anniversary of its Live at APEX program. Live at APEX is the joint effort of Indium Corporation and its industry partners. Developed as a means of accurately and honestly depicting the performance of the company's materials and processes, the program places Indium Corporation products into live equipment demonstrations on the APEX show floor.
Indium Corporation's Dr. Lee, Dr. Liu, Keck and Page Recognized with Honorable Mention at IPC APEX EXPO
Mar 27, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.
Indium Corporation Experts Reflect on 80 Years of Technology Innovation and Growth
Mar 13, 2014 | What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Indium Corporation Hires Associate Director for Sales and Marketing for Asia-Pacific Region
Mar 12, 2014 | Indium Corporation announces that Tony Teo has been hired as Associate Director for Sales and Marketing for the Asia-Pacific region, including China.
Indium Corporation Product Specialist to Present at IMAPS Device Packaging.
Mar 07, 2014 | Indium Corporation's Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.
Indium Corporation’s Ryan to Present at SMTA Intermountain Technical Meeting
Mar 05, 2014 | Indium Corporation's Americas Sales Manager Pat Ryan will present at the SMTA Intermountain Chapter's technical meeting on March 6 in Logan, Utah.
Indium Corporation Features SACM™ High-Reliability Solder Paste at APEX
Mar 04, 2014 | Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada.
Indium Corporation Features BiAgX™: New, High Temperature, Lead-Free Solder Paste Technology at Semicon China.
Mar 04, 2014 | Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Indium Corporation Technology Experts to Present at APEX
Feb 27, 2014 | Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Indium Corporation VP of Technology to Present at Regional SMTA Expos.
Feb 18, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the regional SMTA expos in Plano and Stafford, Texas.
Indium Corporation Announces New Solder Paste Technology
Jan 31, 2014 | Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Indium Corporation Announces Tim Jensen as Senior Product Manager for Engineered Solder Materials
Jan 29, 2014 | Indium Corporation announces that Tim Jensen has been named the Senior Product Manager for Engineered Solders.
Indium Corporation Hires Glen Thomas as Product Manager for Solder Paste
Jan 29, 2014 | Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Indium Corporation VP of Technology to Deliver Webtorial
Jan 14, 2014 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present Properties and Applications of Low-Temperature Solders as part of a webinar sponsored by the SMTA on January 28 from 1-3 p.m.
Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing
Dec 10, 2013 | Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Indium Corporation, Kyzen, DEK Host Seminar in the Philippines
Dec 03, 2013 | Indium Corporation, Kyzen, and DEK hosted a technical seminar on November 27, 2013 in Manila, Philippines. The seminar, titled Soldering, Cleaning & Machine Efficiency, featured presentations by Sehar Samiappan, area technical manager – Indium Corporation; Jason Chan, technical applications manager – Kyzen; and Lee Hong Kim, solutions engineering manager – DEK. Each presenter delivered two presentations.
Indium Corporation Technology Expert to Present at EPTC
Nov 25, 2013 | Indium Corporation's Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Indium Corporation's Pony Liao Earns Six Sigma Black Belt Certification
Nov 20, 2013 | Indium Corporation is pleased to announce that Pony Liao, area technical manager - Northern China, has earned his Six Sigma Black Belt certification through the American Society for Quality.
Indium Corporation Instructors Support SMTA Recertification Process
Nov 19, 2013 | Three Indium Corporation experts and SMTA-certified instructors will assist recertification efforts: Dr. Ron Lasky, senior technologist; Iván Castellanos, technical services manager - Latin America; and David Hu, technical manager - China. These instructors have extensive experience supporting the SMTA’s local training programs in the USA, Central and South America, and Asia.
Indium Corporation’s Technology Experts to Present at IPC Conference on Assembly and Reliability
Nov 14, 2013 | Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Indium Corporation Wins Global Technology Award
Nov 14, 2013 | Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability
Nov 08, 2013 | Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.
Indium Corporation Technology Expert to Present at SMTA Penang
Nov 06, 2013 | Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.
Indium Corporation's Technology Experts to Present at SMTA/iNEMI
Nov 05, 2013 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies
Nov 01, 2013 | Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.
Indium Corporation's SACM™ Provides Superior Drop Shock Performance AND Thermal Cycling Reliability
Nov 01, 2013 | Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Indium Corporation Hires New Applications Engineer in Europe
May 31, 2012 | Indium Corporation announces that Eugene Davies has been named applications engineer. He will be based at Indium Corporation’s Milton Keynes, UK, location.
Indium Corporation Features Indium8.9 Solder Paste at APEX
Feb 16, 2012 | Indium8.9 Solder Paste offers Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.
Indium Corporation Technology Experts Presenting at IPC Midwest
Aug 24, 2011 | Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition
Indium Corporation Technology Expert Presenting at Huntsville SMTA Expo and Tech Forum
Jun 01, 2011 | Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at the Huntsville SMTA Expo and Tech Forum on June 22, in Huntsville, AL.
Indium Corporation Technology Expert Presents Professional Development Course at ECTC 2011
May 19, 2011 | Indium Corporation's Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.
Indium Corporation Technology Expert Presenting at SMTA Capital Chapter
May 06, 2011 | Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at SMTA's Capital Chapter meeting on May 17, 2011, at Johns Hopkins University's Applied Physics Laboratory in Laurel, MD.
Indium Corporation Technology Expert Presenting at SMTA Toronto
Apr 29, 2011 | Indium Corporation Technical Support Engineer Ed Briggs will present his technical findings at SMTA Toronto Expo and Tech Forum, Toronto, Canada, May 5, 2011.
Indium Corporation Technology Experts Presenting at IMAPS New England
Apr 27, 2011 | Two of Indium Corporation's technology experts will present their technical findings at IMAPS New England in Boxboro, MA, May 3, 2011.
Indium Corporation Features Indium8.9 Series Solder Pastes at APEX
Apr 07, 2011 | Indium8.9 Series solder pastes offer Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.
Indium Corporation's Dr. Andy Mackie to Present at SMTA Intermountain
Mar 21, 2011 | Indium Corporation's Global Product Manager, Semiconductor and Advanced Assembly Materials, Dr. Andy Mackie , will be presenting at the Surface Mount Technology Association (SMTA) Intermountain Expo and Technical Forum, March 22, 2011 at Boise State University, Boise ID.
Indium Corporation Expands Sales Efforts in Canada
Feb 22, 2011 | Indium Corporation announces that they have appointed CCR as its newest sales channel partner in Canada. CCR is responsible for distributing Indium’s solder products, including solder paste, wire, rework fluxes, engineered solders, and thermal interface materials.
Indium Corporation Hires Trade Compliance Manager
Jan 14, 2011 | Indium Corporation announces that Mary Beth Coholan has joined the company as a Trade Compliance Manager.
Indium Corporation Announces New Technical Support Engineer
Dec 07, 2010 | Indium Corporation announces that Nicole Palma has accepted the position of Technical Support Engineer.
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