Oct 31, 2017 | At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Mar 01, 2017 | ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
Apr 07, 2016 | At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
Mar 22, 2016 | Launched less than a year ago, ECD’s SmartDRY™ intelligent dry storage technology has dramatically changed the way manufacturers approach storage for moisture-sensitive devices (MSDs). With SmartDRY’s many unique features, electronics assembly specialists now have an affordable, sophisticated dry storage solution that is more conducive to dynamic manufacturing environments.
Nov 01, 2015 | High-mix, medium-volume contract manufacturer, EI Microcircuits specializes in high-quality design, engineering and production of PCBs used in the industrial controls, medical and government sectors. With diverse and multiple jobs running throughout the Southern Minnesota-based EMS firm’s three facilities, ensuring tight reflow soldering processes is critical to high-yield and cost-effective manufacturing. For this important assembly process, EI Microcircuits relies on ECD’s M.O.L.E.® thermal profiling and OvenRIDER® technologies.
Sep 11, 2014 | ECD has named Todd Clifton as the company's new President to succeed founder and former President, Rex Breunsbach, who is downsizing his role at ECD. Clifton previously was ECD’s Vice-President of Sales and Marketing.
Nov 05, 2012 | ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
May 31, 2012 | Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Apr 13, 2009 | ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification.
Apr 09, 2009 | ECD is proud to announce the release of the newest resource for it's customers. ECD Thermosphere will be covering topics from thermocouple attachment to "Wavy Profiles"
Aug 02, 2001 | Mr. Ray Chartrand, one of the leading experts in the Soldering Industry, in concert with ECD will be holding a series of cost-saving Profiling Seminar during August 2001. Ray has over 20 years experience troubleshooting soldering, reflow, and cleaning problems for the electronics industry and presently consults for over 40 of the largest industries in the electronic assembly marketplace.
Aug 02, 2001 | ECD has announced that its new Guide to Quality Control of the Automated Solder Process is now available. This 16 page Guide will provide users with important information about Classic PCB Temperature Profiling as well as how to maintain a wave or reflow solder machine in "factory-new" condition.