SMT, PCB Electronic Industry News

News Releases from Association Connecting Electronics Industries (IPC)

Read Association Connecting Electronics Industries (IPC) company news


1476 news releases added by Association Connecting Electronics Industries (IPC)

Company Information:

IPC is the trade association for the printed wiring board and electronics assembly industries.

Bannockburn, Illinois, USA

Association / Non-Profit, Events Organizer, Training Provider

  • Phone 847-615-7100
  • Fax 847-615-7105

See IPC Website »

Company Postings:

(3) products in the catalog

(3) upcoming training courses

(2) technical library articles

(1476) news releases

California Chapters of IPC and SMTA Host Annual Golf Get-Together

Sep 02, 2010 | Combining fun in the sun with philanthropy, IPC California and the Los Angeles and Orange County Chapters of the Surface Mount Technology Association (SMTA) held their 11th Annual Golf Event on August 16, 2010. More than 100 banquet attendees and 86 golfers enjoyed a warm summer day at the Old Ranch Country Club in Seal Beach, California. The two organizations expect to donate more than $2000 from the proceeds to a local charity.

IPC Electronics Assembly Conference in Budapest Offers Critical Information on Quality and Reliability

Aug 31, 2010 | Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6­–7 October, 2010.

IPC Releases PCB Industry Results For July 2010

Aug 31, 2010 | Association Connecting Electronics Industries® announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Trends in the Book-to-Bill Ratio for Rigid PCBs

Changes in Key Electronics Manufacturing Standards Focus of Half-day Workshops at Electronics Midwest

Aug 25, 2010 | Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.

IPC ELECTRONICS TRAINING MEDIA NOW OFFERS AUTOMATED TESTING FEATURE

Aug 25, 2010 | IPC — Association Connecting Electronics Industries® announces a new automated testing feature now available for purchasers of IPC electronics assembly DVD or OVT (Online Video Training) products. Automated testing can be used in conjunction with any of IPC’s extensive library of electronics assembly training videos, verifying understanding in key subject areas.

CALL FOR PARTICIPATION IN THE 12th ELECTRONIC CIRCUITS WORLD CONVENTION

Aug 25, 2010 | IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 12th Electronic Circuits World Convention (ECWC12) taking place November 9–11, 2011, at the Taipei Nangang Exhibition Center, Taiwan

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Aug 04, 2010 | Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

IPC Industry Executive Conference Features Forecasts, Materials, Issues And Executive Sessions.

Aug 04, 2010 | In an industry in transition, it is incumbent upon executives to make difficult choices on new investments, resource allocation and expansion. To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13–14, 2010, in Palm Springs, Calif., sponsored by IPC — Association Connecting Electronics Industries®.

The IPC Electronics Industry Executive Summit will cover some of the latest trends in markets, technologies and management issues so you can change with the industry.

IPC RELEASES PCB INDUSTRY RESULTS FOR JUNE 2010

Jul 29, 2010 | Association Connecting Electronics Industries® announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Jul 22, 2010 | IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

ONLINE REGISTRATION NOW OPEN FOR ELECTRONICS MIDWEST

Jul 20, 2010 | Collaborating to offer an unmatched regional event for companies and their employees, IPC — Association Connecting Electronics Industries® and Canon Communications are bringing the best of the global electronics manufacturing industry together at Electronics Midwest, September 28–30, 2010. Taking place at the Donald E. Stephens Convention Center in Rosemont, this premier event will feature an exhibition as well as an IPC technical conference on electronics sustainability, workshops on new standards and assembly materials, and IPC standards development meetings.

IPC Issues Call for Participation for Electronics Assembly Conference in Budapest

Jul 16, 2010 | To assist international electronics assembly suppliers in reaching the rapidly growing Central and Eastern European electronics market, IPC — Association Connecting Electronics Industries® will host the IPC Electronics Assembly Quality & Reliability Conference and table top exhibition. The event, supported by the National Electronics Society of Hungary, will be held 6–7 October 2010, in Budapest, Hungary.

IPC AND ESDA COLLABORATE ON REQUIRED ESD TRAINING FOR ELECTRONICS ASSEMBLY OPERATORS

Jul 12, 2010 | The safe and proper control of electrostatic discharge (ESD) is one of the most critical challenges facing the electronics industry today. To address this vital concern, IPC — Association Connecting Electronics Industries® and the Electrostatic Discharge Association (ESDA) released a new ESD training video, DVD-74C, ESD Control for Electronics Assembly.

Nation’s Fastest Growing Electronics Manufacturing Marketplace Gears Up for Electronics Midwest

Jul 09, 2010 | With recent PCB book-to-bill reports showing positive signs of economic recovery in North America, the timing for building business in the electronics manufacturing industry seems ideal, especially in the Midwest. Helping companies take advantage of the favorable conditions and new industry trends, IPC — Association Connecting Electronics Industries® and Canon Communications have joined forces to produce Electronics Midwest, an exhibition and technical conference for the electronics assembly and printed board design and manufacturing industries.

IPC and IPCA Comment on India's Proposed E-Waste Rules 2010

Jul 08, 2010 | Working together to address the latest round of proposed substance restrictions, IPC and the Indian Printed Circuits Association (IPCA) have submitted comments in response to the Indian Government’s Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.

IPC Celebrates Victory in Canada: Canadian Government Will Not Restrict Rosins

Jul 02, 2010 | In a victory for IPC members and the Canadian electronics industry, the Canadian Department of the Environment, on June 26, 2010, elected not to ban five rosin-containing substances from all products manufactured and sold in Canada.

IEEE Standards on Environmentally Preferable Electronic Equipment Will Impact Entire Electronics Manufacturing Supply Chain — IPC Urges Industry Members to Get Involved in the Ballot

Jun 30, 2010 | Two IEEE standards on setting criteria for environmentally preferable electronic equipment will soon go to ballot: 1680.2 Draft Standard for Environmental Assessment of Imaging Equipment and 1680.3 Draft Standard for the Environmental Assessment of Televisions...

IPC RELEASES PCB INDUSTRY RESULTS FOR MAY 2010

Jun 28, 2010 | BANNOCKBURN, IL — IPC - Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

IPC Members Visit 70 Congressional Offices in D.C. — All in a Capitol-Hill-Day’s Work

Jun 21, 2010 | BANNOCKBURN, IL — IPC members put democracy to work as they participated in IPC’s Capitol Hill Day (CHD), June 9–10, 2010, in Washington, D.C. Representing the largest PCB manufacturers, EMS companies and industry suppliers in North America, IPC members visited 70 Congressional offices advocating support for legislation to strengthen the North American electronic interconnect industry.

IPC Electronics Symposium to Highlight RoHS Revisions, Other Key Regulations

Jun 21, 2010 | BANNOCKBURN, IL — Environmental regulations on chemicals and substances continue to grow worldwide, often driven by political pressures. While some focus on manufacturing wastes, such as air and wastewater emissions, there is a growing lexicon of regulations which focus on the chemicals contained in products. To help companies understand new laws, regulations and regulatory trends, IPC will hold an IPC Symposium on Electronics and the Environment on July 19–21, 2010, in Boston, Mass.

IPC Releases Position Statement on the Trade of Conflict Metals

Jun 16, 2010 | BANNOCKBURN, IL — The Solder Products Value Council (SPVC) of IPC — Association Connecting Electronics Industries® issued the organization’s position statement on conflict metals during a Supply Chain Workshop held on May 20, 2010, by the Electronic Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI) in Vancouver, British Columbia.

First-Ever Power Conversion Standard IPC-9592 Gets Update

Jun 11, 2010 | BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.

European Parliament Environment Committee Vote Puts TBBPA on Priority Assessment List

Jun 04, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® today expressed disappointment in the vote by the European Parliament’s Environment Committee to include broad families of chemicals, such as organobromines, in Annex III for priority assessment. While an outright ban of these chemicals has been averted in this vote, the committee’s decision falls far short of supporting a rigorous scientific assessment that would ensure protection of the environment and human health.

IPC RELEASES STUDY OF QUALITY BENCHMARKS FOR EMS INDUSTRY

Jun 04, 2010 | BANNOCKBURN, Ill., USA — In response to member requests for benchmarking data, IPC — Association Connecting Electronics Industries® released IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2009. This report is designed to provide information to EMS companies interested in comparing their key 2009 operating variables to those of other EMS providers by net sales and type of product.

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

Jun 04, 2010 | BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.

IPC Releases PCB Industry Results For April 2010

May 30, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

TBBPA Ban Proposal Dropped; IPC Continues to Lobby for Scientific Basis in Directive

May 30, 2010 | BANNOCKBURN, Ill., USA — Efforts by IPC — Association Connecting Electronics Industries® to bring sound scientific analysis to the RoHS Directive were rewarded when RoHS Rapporteur and Green Party member Jill Evans announced plans to drop amendments calling for a ban of all brominated flame retardants (BFRs), including those, such as tetrabromobisphenol-A (TBBPA), that have been found safe under European Union risk assessment.

IPC Strives for Genuine Benefits to Environment and Human Health in EU Legislation

May 26, 2010 | BANNOCKBURN, Ill., USA — In communications sent to Members of the European Parliament (MEPs) last week, IPC — Association Connecting Electronics Industries® lent its support to the adoption of RoHS Directive proposed amendments 197 through 203. These amendments support the use of a rigorous scientific methodology to evaluate additional restricted substances and their alternatives.

IPC RELEASES PCB INDUSTRY RESULTS FOR MARCH 2010

Apr 27, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Key Political Figures to Speak at IPC’s Capitol Hill Day

Apr 27, 2010 | BANNOCKBURN, Ill., USA — As U.S. companies in the electronics interconnect industry roll up their sleeves to get down to business at IPC’s Capitol Hill Day, two Washington insiders will be sharing their insights on influencing public policy. IPC’s Capitol Hill Day on June 9–10, 2010, will feature Charles “Charlie” Black, Jr. and U.S. Rep. Maurice Hinchey of New York as the keynote and luncheon speakers respectively. The event will focus on influencing legislators on issues critical to the global competitiveness of the electronic interconnect industry.

Mel Parrish Elected to Chair IPC’s Top Standards Development Leadership Committee

Apr 23, 2010 | BANNOCKBURN, Ill., USA, IPC — Association Connecting Electronics Industries® announces the election of Mel Parrish, FSO and director of training materials, STI Electronics Inc., to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term.

New A Revision of IPC-4202 Gives Updated Guidance in Flexible Base Dielectric Materials

Apr 23, 2010 | BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.

IPC APEX EXPO 2010 HONORS BEST INDUSTRY POSTERS AND ACADEMIC POSTER COMPETITION WINNERS

Apr 23, 2010 | BANNOCKBURN, Ill., USA — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries® announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6–8, 2010 in Las Vegas.

Increased Attendance at IPC APEX EXPO 2010 Hails Visible End to Recession

Apr 23, 2010 | BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® has released verified attendance figures from IPC APEX EXPO™, held April 6–9, 2010, in Las Vegas, indicating a 10 percent increase over last year with 3,702 attendees.

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Apr 19, 2010 | BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Save more than $300 on new IPC standards.

Apr 16, 2010 | IPC has released updates to key standards that affect your business. New versions of printed board standards IPC-A-600 and IPC-6012 have been released, along with key assembly standards IPC-A-610 and J-STD-001. If you become a member now, you will be eligible to get free copies of all of these standards, saving up to $393. And, of course, as more new standards are published, you can request a copy within 90 days, adding to your savings!

Jack Bramel Receives IPC Raymond E. Pritchard Hall of Fame Award

Apr 11, 2010 | BANNOCKBURN, Ill., USA — In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Jack Bramel, Jack Bramel & Associates was awarded the 2009 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.

IPC Elects New Officers/Members to Board of Directors

Apr 10, 2010 | The Nominating and Governance Committee of the IPC Board of Directors presented six candidates for election at the IPC Annual Meeting, on Tuesday, April 6, 2010, in conjunction with IPC APEX EXPO™ in Las Vegas. Three candidates were elected as board officers and will serve two-year terms covering April 2010 through March 2012. The other three candidates were elected as board directors and will serve four-year terms, covering April 2010 through March 2014.

IPC HONORS BEST PAPERS AT IPC APEX EXPO 2010

Apr 10, 2010 | IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Volunteers Honored for Their Contributions to IPC and Industry

Apr 10, 2010 | IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.

DuPont and Raytheon Company Honored with 2010 IPC Corporate Recognition Awards.

Apr 10, 2010 | IPC — Association Connecting Electronics Industries® yesterday bestowed its highest corporate honors to Raytheon Company and DuPont. During the IPC Annual Meeting Luncheon held in conjunction with IPC APEX EXPO™, IPC awarded the Stan Plzak Corporate Recognition Award upon Raytheon Company and the Peter Sarmanian Corporate Recognition Award upon DuPont. Leaders and innovators within their respective industries, both companies have been long-time IPC supporters.

Bob Black Awarded the IPC President's Award

Apr 10, 2010 | IPC - Association Connecting Electronics Industries® honored Bob Black, president and CEO of Juki Automation Systems, Inc. with the coveted IPC President’s Award at IPC APEX EXPO™, April 6, 2010. This prestigious award is presented to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronics interconnect industry.

Updated Materials Declaration Standard IPC-1752A Addresses Revolving Door of Environmental Regulation Changes.

Apr 10, 2010 | Helping electronics manufacturing companies better manage the growing documentation required to ensure products comply with evolving environmental regulations, IPC — Association Connecting Electronics Industries® has released IPC-1752A, Materials Declaration Management. The A revision of the standard provides an updated and expanded industry-wide reporting format for material declaration data exchange between companies in the electronic interconnect supply chain.

IPC-A-610E Released: Industry Requirements for Acceptability of Electronic Assemblies Updated.

Apr 10, 2010 | IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Apr 10, 2010 | If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Apr 10, 2010 | IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Apr 10, 2010 | IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

IPC International Conference Offers Answers to Chalenges of Flexible Circuits.

Mar 27, 2010 | BANNOCKBURN, Ill, USA, - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company’s bottom line.

IPC Releases PCB Industry Results for February 2010

Mar 27, 2010 | BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Trends in the Book-to-Bill Ratio for Rigid PCBs.

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Mar 27, 2010 | BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

Capillary Underfill Dispensing

SMT fluid dispensing